Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) and a leading supplier of automated optical and x-ray inspection systems for the electronics industry, will showcase their latest generation M1m AOI at the 42nd annual SEMICON West 2012. Held at the Moscone Center in San Francisco, California from July 10-12.

Nordson YESTECH’s M1m is designed for automated inspection of advanced microelectronics and semiconductor packages with specific inspection algorithms for:
Wire / wire bond inspection: presence, quality, position
High accuracy die inspection
Surface finish inspection for contamination, scratches and chip-outs
Epoxy underfill,
Paste / epoxy squeeze-out and bridging
Material dimensional inspection

Nordson YESTECH’s advanced megapixel color technology offers high-speed device inspection with exceptional defect coverage, all within a footprint less than 1 sq. meter. The M1m can be put in-line or off-line with an optional magazine loader / unloader. The M1m can be put in-line with your wire bonders or off-line to support several bonders

Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The M1m also provides SPC data, defect reports, offline defect classification, offline rework capability and even archived images of every device inspected. In addition, Nordson YESTECH also provides free software upgrades for the life of the system.

“We are very excited be attending this year’s SEMICON West show and to showcase our latest M1m AOI inspection system.” said Nordson YESTECH Manager, Scott Roberson. “The M1m is unique to the industry, offering the latest technology for demanding microelectronics applications.”