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miniature thermoelectric modules (TEMs) Moves Heat in a Different Direction
Laird Technologies Inc. (, U.S.A.)
Feb. 12, 2014 Laird, a global technology company, has announced a new series of miniature thermoelectric modules (TEMs) built using Laird Tlam thermally conductive

Behlman power supply supports anti-submarine and anti-ship surveillance and targeting systems
Behlman Electronics, Inc. (Hauppauge, U.S.A.)
Feb. 11, 2014 Behlman Electronics Inc., has received an additional order for a quantity of its Model 00389 COTS power supplies. These power supplies have been used

api, interface, programing, arm, iar system, windows

Application Programming Interface (API) supports IAR Systems Embedded Workbench for ARM® for embedded MCU control and Windows 7
Holt Integrated Circuits Inc. (Mission Viejo, U.S.A.)
Feb. 11, 2014 Holt Integrated Circuits introduced a new Application Programming Interface (API) for its MIL-STD-1553 integrated terminal devices, HI-6130 and HI-213

graphic, SoC, interface, automotive, security

Graphics SoC Provides Outstanding Rendering and Multiple Peripheral Interfaces for Industrial Applications
Fujitsu Semiconductor America, Inc. (Sunnyvale, U.S.A.)
Feb. 10, 2014 MB86R24 is FSA's third generation of proven graphics SoCs for automotive, building security and industrial applications. It provides optimal CPU and G

connector, data, high-speed, space saving

SpeedStack Mezzanine Connectors Achieve 40 Gbps Data Rate
Molex Incorporated (Lisle, U.S.A.)
Feb. 06, 2014 The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow

VDC input ChiP bus converter modules enable high voltage DC distribution with 98% efficient conversion to 48V
Vicor Corporation (Andover, U.S.A.)
Feb. 06, 2014 Vicor Corporation unveiled the first module utilizing its Converter housed in Package (ChiP) power component platform. Vicor’s new ChiP bus convert

GNSS modules with 8th generation in-house chip technology
u-blox AG ( Thalwil , Switzerland)
Feb. 06, 2014 NEO, MAX and LEA now available in both performance and cost optimized versions

High performance AdvancedMC module designed for wireless processing applications
CommAgility Limited (Leicestershire, United Kingdom)
Feb. 05, 2014 CommAgility announced the AMC-V7-2C6670, a high performance Advanced Mezzanine Card (AMC) module with the processing power of a Xilinx Virtex®-7 FPGA

Sealed High Power Contactor is Ideal for High Current DC Switching
Gigavac (Santa Barbara, U.S.A.)
Feb. 05, 2014 The Single Pole Single Throw – Normally Open (SPST‐NO) GX110 is rated for continuous duty up to 1000 amps andcapable of switching high current lo

bipolar prom, OEM, semiconductor, military, aerospace

Bipolar PROMs serve as drop-in replacements for OEM devices
e2v technologies (Gröbenzell, Germany)
Jan. 29, 2014 These devices serve as drop-in replacements for the original devices, manufactured by a variety of suppliers, including Philips/Signetics, Harris, MMI

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